Featuring a single-wire return-to-zero (NZR) communication protocol, the SK6803-EC10 supports infinite cascading while maintaining precise individual pixel control. Its low power consumption and robust electrostatic discharge (ESD) protection ensure long-term reliability in demanding environments. Whether you are designing high-density LED matrices or subtle ambient lighting, the SK6803-EC10 offers unmatched flexibility and vibrant visual performance. Experience the perfect synergy of micro-engineering and brilliant illumination with OPSCOLED’s cutting-edge EC series.
Ultra-Miniature 1010 Package: Measures only 1.0x1.0x0.4mm, the smallest form factor available, perfect for high-density and space-constrained designs like ultra-thin keyboards and smart wearables.
Integrated Driver IC: Built-in signal reshaping and amplification circuit ensures stable signal transmission and infinite cascading capability without signal degradation.
True 24-bit Color Depth: Supports 256-level grayscale per channel (R/G/B), rendering 16.7 million colors for smooth gradients and vivid, true-to-life lighting effects.
Single-Wire Control Protocol: Simplifies PCB layout and reduces MCU pin usage by utilizing a single data line for data transmission and addressing.
Low Power & High Reliability: Operates at low current with a wide voltage range (3.7V-5.5V) and features reverse connection protection and excellent heat dissipation.
OPSCO SK6803-EC10 Product Datasheet
|
Parameter |
Specification |
|---|---|
|
Part Number |
SK6803-EC10 (OPSCOLED) |
|
Package Size |
1.0 x 1.0 x 0.4 mm (1010) |
|
LED Type |
RGB Full Color (Integrated) |
|
Input Voltage (VDD) |
3.7V - 5.5V (Typical 5V) |
|
Signal Protocol |
Single-wire NZR (Return-to-Zero) |
|
Data Transfer Rate |
800 kbps |
|
Gray Scale |
256 levels per color (8-bit x 3) |
|
Colors |
16,777,216 (True Color) |
|
Refresh Rate |
> 400 Hz (supports high-speed photography) |
|
Cascading |
Unlimited (Data Out to Data In) |
|
Operating Temp. |
-40°C to +85°C |
|
Storage Temp. |
-40°C to +105°C |
|
ESD Protection |
HBM > 2kV |
|
Pin Configuration |
1: VDD, 2: DOUT, 3: GND, 4: DIN |
Pin Definition:
VDD: Power Supply (3.7V-5.5V)
DOUT: Data Output (to next pixel)
GND: Ground
DIN: Data Input (from MCU or previous pixel)
Key Features:
Built-in IC for individual addressability.
Signal reshaping and self-detection function.
Reverse power protection (up to 5.5V).
Highly integrated SMD package for automated assembly.
