Featuring single-line return-to-zero coding and infinite cascade capability, the SK9828RGB-FC13 simplifies wiring while enabling smooth, flicker-free visuals. Perfect for premium LED video walls, architectural lighting, and next-gen smart displays, this chip sets a new benchmark for mini LED pixel technology.
🎨 16-bit True Color Depth — Each RGB channel supports 65,536 gray levels (48-bit total), producing silky-smooth gradients and eliminating color banding for broadcast-quality visuals.
🔧 Flip-Chip (FC) Architecture — Eliminates wire bonds for better heat dissipation, higher current capability, and enhanced durability in compact 1.3×1.3mm form factor.
⚡ High-Speed 1500 kbps Data Transfer — 1.875× faster than standard WS2812/SK6812, enabling higher refresh rates and seamless video playback on dense pixel arrays.
🔗 Single-Wire Cascade & Built-in IC — Simplifies PCB layout with DIN→DOUT daisy-chain; no external driver needed, reducing BOM cost and assembly complexity.
📺 Mini LED Ready — Purpose-built for micro-pitch LED displays, transparent screens, COB/MIP modules, and wearable pixel arrays where space and image quality are critical.
|
Parameter |
Symbol |
Min |
Typ |
Max |
Unit |
Notes |
|---|---|---|---|---|---|---|
|
Supply Voltage |
VDD |
4.5 |
5.0 |
5.5 |
V |
DC power supply |
|
Input Voltage (Data) |
VIH/VIL |
0.7VDD / 0.3VDD |
— |
VDD / 0.3VDD |
V |
CMOS compatible |
|
Data Transfer Rate |
FDR |
— |
1500 |
— |
kbps |
Single-line RZ code |
|
Gray Scale per Channel |
GS |
— |
65536 |
— |
Levels |
16-bit PWM |
|
Total Gray Scale |
— |
— |
281 Trillion |
— |
Colors |
48-bit (R/G/B ×16-bit) |
|
Red Wavelength |
λR |
— |
620–625 |
— |
nm |
Typical InGaN/AlInGaP |
|
Green Wavelength |
λG |
— |
520–525 |
— |
nm |
|
|
Blue Wavelength |
λB |
— |
465–470 |
— |
nm |
|
|
Viewing Angle |
2θ½ |
— |
160 |
— |
° |
Half-intensity |
|
Cascade Distance |
— |
— |
— |
10 |
m |
Between two pixels (recommend) |
|
Operating Temp. |
TOPR |
-40 |
— |
+85 |
°C |
|
|
Storage Temp. |
TSTG |
-55 |
— |
+150 |
°C |
|
|
Package Size |
— |
— |
1.3 × 1.3 |
— |
mm |
Flip-chip, no lead frame |
|
Protocol |
— |
— |
48-bit/frame |
— |
— |
R/G/B each 16-bit, MSB first |
Pin Definition (Bottom View, Flip-Chip Pads):
|
Pad |
Function |
Description |
|---|---|---|
|
VDD |
Power |
5V DC supply |
|
VSS |
Ground |
Negative supply |
|
DIN |
Data In |
Serial data input from controller/previous IC |
|
DOUT |
Data Out |
Serial data output to next IC |
Typical Application Circuit:
Controller → [DIN] SK9828RGB-FC13 [DOUT] → [DIN] SK9828RGB-FC13 [DOUT] → … (daisy chain)
│ │
VDD VDD
│ │
GND GNDNotes:
Decoupling capacitor (0.1 µF) recommended near each chip VDD pin.
Data line impedance matching may be required for long cascades (>2m).
Reflow soldering profile must comply with flip-chip Pb-free process (peak 245°C max).
